BeQuiet Jubiläum Banner 970x90
Breaking News

Ultimate Ears Launches New Editions of Award-Winning WONDERBOOM and HYPERBOOM Speakers Reach New Levels of Total Immersion with Logitech Chorus for Meta Quest 2 Lucky number Android 13: The latest features and updates CORSAIR Ushers in the New Era of AMD with Support for AMD Ryzen 7000 CPUs TEAMGROUP Announces MP44L M.2 PCIe 4.0 SSD with the Industry's First Heat Dissipating Graphene SSD Label for an Upgraded Cooling Performance

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm

Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm

Enterprise & IT Mar 12,2020 0

Everspin Technologies, Inc. has amended its Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) with GLOBALFOUNDRIES to set the terms for a future project on an advanced 12nm FinFET MRAM solution.

Everspin and GF have been partners on 40nm, 28nm, and 22nm STT-MRAM development and manufacturing processes. The company is in production of discrete STT-MRAM solutions on 40 and 28nm, including its 1Gb DDR4 device. GF recently announced it has achieved initial production of embedded MRAM (eMRAM) on its 22FDX platform.

Everspin has over 650 patents and applications related to MRAM in its intellectual property portfolio and is the only memory manufacturer in production of discrete MRAM.

The company says it has already shipped over 125M units of discrete MRAM products to date and has over 1000 customers. GF is leading in eMRAM development and aims to displace embedded flash memory, particularly in microcontroller applications and wireless connected IoT. eMRAM provides superior performance to eFlash, particularly write speeds and lower power, and supports long term data retention at the higher temperatures that embedded applications require. eMRAM is also well suited to replace eSRAM due to its data persistence, lower power and size with similar performance and endurance capabilities.

Everspin’s STT-MRAM and Toggle MRAM devices deliver protection against power loss without the use of supercapacitors or batteries, and in many applications provide the performance and endurance required for code and data storage in a single persistent device.

Tags: MRAMEverspinGLOBALFOUNDRIES
Previous Post
Realme X50 Pro 5G Flagship Launches in China
Next Post
Redmi Note 9 Pro Max Launched In India

Related Posts

  • Globalfoundries Offers Post-Fab Turnkey Services As 5G Arrives

  • GLOBALFOUNDRIES Delivers Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications

  • STT-MRAM Coming to Industrial and IoT Applications

  • Everspin Releases Design Guide for using 1 Gb STT-MRAM with Xilinx DDR4 FPGA Controller

  • Researchers Demonstrate High-speed SOT-MRAM Memory Cell Compatible with 300mm Si CMOS Technology

  • Everspin Achieves Record STT-MRAM Revenue

  • GLOBALFOUNDRIES and SiFive to Deliver HBM2E Memory on 12LP Platform

  • Everspin Adds 2Mb, 8Mb and 32Mb Capacities to Its Toggle MRAM Product Portfolio

BeQuiet Jubiläum Banner 300x600

 

Latest News

Ultimate Ears Launches New Editions of Award-Winning WONDERBOOM and HYPERBOOM Speakers
Consumer Electronics

Ultimate Ears Launches New Editions of Award-Winning WONDERBOOM and HYPERBOOM Speakers

Reach New Levels of Total Immersion with Logitech Chorus for Meta Quest 2
Consumer Electronics

Reach New Levels of Total Immersion with Logitech Chorus for Meta Quest 2

Lucky number Android 13: The latest features and updates
Consumer Electronics

Lucky number Android 13: The latest features and updates

CORSAIR Ushers in the New Era of AMD with Support for AMD Ryzen 7000 CPUs
PC components

CORSAIR Ushers in the New Era of AMD with Support for AMD Ryzen 7000 CPUs

TEAMGROUP Announces MP44L M.2 PCIe 4.0 SSD with the Industry's First Heat Dissipating Graphene SSD Label for an Upgraded Cooling Performance
PC components

TEAMGROUP Announces MP44L M.2 PCIe 4.0 SSD with the Industry's First Heat Dissipating Graphene SSD Label for an Upgraded Cooling Performance

Popular Reviews

CeBIT 2005

CeBIT 2005

CeBIT 2006

CeBIT 2006

Zidoo Z9S 4K Media Player review

Zidoo Z9S 4K Media Player review

LiteOn iHBS112 review

LiteOn iHBS112 review

Club3D HD3850

Club3D HD3850

External USB Slim Recorders Comparison

External USB Slim Recorders Comparison

Pioneer BDR-2207 (BDR-207M) BDXL burner review

Pioneer BDR-2207 (BDR-207M) BDXL burner review

Crucial P1 NVMe 1TB SSD review

Crucial P1 NVMe 1TB SSD review

Main menu

  • Home
  • News
  • Reviews
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed