H L Data Storage Store Banner 970x90
Breaking News

MSI's Modern AM272 Series All-in-One PC be Your Trusted Partner for Business Akasa’s Alucia H4 Plus and SOHO H4 Plus are now compatible with LGA 1700! be quiet! Silent Wings 4 and Silent Wings Pro 4: Reaching new heights in airflow and static pressure Thermaltake Announces Toughpower PF1 1050W/1200W Samsung Gaming Hub Now Available on 2022 Smart TVs and Smart Monitor Series

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

Samsung's Semiconductor and Automotive Solutions at CES 2019

Samsung's Semiconductor and Automotive Solutions at CES 2019

Enterprise & IT Jan 11,2019 0

At CES 2019, Samsung Electronics exclusively showcased at a specialized exhibition event its semiconductor and automotive technologies to key customers and partners.

Automotive Solutions

Samsung’s automotive solution offerings included key components and technologies for in-vehicle infotainment, telematics and the advanced driving assistance system (ADAS).

The recently announced Exynos Auto V9 is Samsung’s first dedicated automotive system-on chip for next-generation IVI (In-Vehicle Infotainment) systems. The Exynos Auto V9 can support up to six high resolution displays through processing from eight core CPUs and a tri-cluster GPU, a GPU arranged in three separated sets of GPU cores able to support multiple systems simultaneously. The Exynos Auto V9 is also equipped with a neural processing unit (NPU) that processes visual and audio data to recognize face, speech and gesture patterns. The showcase demo presented driving assistant and entertainment experiences – for example, the running of navigation in the central information display (CID) at the same time as a movie plays in rear-seat displays.

Exynos Auto T is a telematics solution that integrates telecommunications and informatics technologies. The first cellular modem to support multi-mode from 2G to 5G NR, the Exynos Modem 5100, was also showcased.

Another demonstration showcased how the ADAS system can recognize and detecting all manner of objects such as cars, pedestrians and traffic signs. Furthermore, the DRVLINE, an open, modular and scalable platform for building ADAS with a faster time to market, was introduced.

ISOCELL Auto image sensor is a new solution used to detect objects in a variety of lighting conditions. The ISOCELL Auto image sensor technology provides object recognition in a diverse range of driving environments, as the sensor’s high resolution and fast frame rate enables the accurate detection of any moving objects, while its high light sensitivity assists in object recognition even in dark lighting conditions. Furthermore, a wide dynamic range permits the sensor to respond quickly to sudden changes in brightness, as one might experience when driving in or out of dimly-lit tunnels.

Innovative Pixel Solution for Smart ADB (Adaptive Driving Beam) is the next-generation one-chip LED solution for headlamps that helps prevent glare affecting preceding and oncoming vehicles or pedestrians by automatically controlling the light distribution of a headlamp. Samsung presented this specialized LED solution by demonstrating different driving situations including when a driver starts the engine, needs high or low beam, and faces preceding or oncoming vehicle.

Semiconductor Technologies

This year, five of Samsung’s latest semiconductor products have received recognition from the CES 2019 Best of Innovation Awards – the Samsung 256GB 3DS DDR4 RDIMM, 512GB Universal Flash Storage, 3.84TB NVMe Z-SSD SZ1733, LM302S and the SSM-U Series.

Samsung 256GB 3DS DDR4 RDIMM is the fastest DDR4 and highest density memory module for enterprise server platforms, providing high-density, high-performance consumer infrastructure solutions with low-power consumption (15 watts at 1.2V).

Samsung 512GB Universal Flash Storage is the first 512-gigabyte embedded Universal Flash Storage (eUFS) for automotive A/V systems and next-gen flagship mobile devices, using Samsung’s new 64-layer 512-gigabit V-NAND chips. The 512GB eUFS package transfers a 5GB-equivalent full HD video clip to an SSD in about six seconds, over 8 times faster than a typical microSD card.

Samsung 3.84TB NVMe Z-SSD SZ1733 has been designed for supercomputers targeted for AI analysis, big data and IoT applications. It is using Samsung’s new Z-NAND chips to provide 10 times higher cell read performance than 3-bit V-NAND chips.

Samsung LM302S is a user-oriented next-generation lighting platform, designed to improve work efficiency by helping users achieve a better circadian rhythm and healthier sleep. Samsung says that its human-centric LED solution can improve a person’s concentration level for greater work efficiency by as much as 10% and improve sleep quality by repressing melatonin during the day.

Samsung SSM-U Series is a new type of smart module made up of tiny radar-based sensors with higher detecting sensitivity than conventional sensors. The SSM-U series features invisible and intelligent motion detection-based transmission for greater flexibility and reactivity in smart residential lighting.

Tags: SAMSUNGexynosSSDsCES 2019
Previous Post
CES 2019: QNAP Showcased AI Solutions and Refreshed Edge Computing
Next Post
WSJ Expects Three New iPhones This Year, One With Three Rear Cameras

Related Posts

  • Samsung Gaming Hub Now Available on 2022 Smart TVs and Smart Monitor Series

  • Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture

  • Meet the New Galaxy XCover6 Pro

  • Samsung Unveils ISOCELL Image Sensor With Industry’s Smallest 0.56μm Pixel

  • Samsung Electronics Debuts ‘Stranger Things’ Inspired Short Film With Galaxy S22 Ultra

  • Samsung Electronics announced the ViewFinity S8 Monitor

  • Samsung Wallet: An Easy-To-Use, Secure Platform

  • Samsung and Microsoft Partner to Bring The Xbox App to Samsung Gaming Hub

H L Data Storage Store Banner 300x600

 

Latest News

MSI's Modern AM272 Series All-in-One PC be Your Trusted Partner for Business
PC components

MSI's Modern AM272 Series All-in-One PC be Your Trusted Partner for Business

Akasa’s Alucia H4 Plus and SOHO H4 Plus are now compatible with LGA 1700!
Cooling Systems

Akasa’s Alucia H4 Plus and SOHO H4 Plus are now compatible with LGA 1700!

be quiet! Silent Wings 4 and Silent Wings Pro 4: Reaching new heights in airflow and static pressure
Cooling Systems

be quiet! Silent Wings 4 and Silent Wings Pro 4: Reaching new heights in airflow and static pressure

Thermaltake Announces Toughpower PF1 1050W/1200W
PC components

Thermaltake Announces Toughpower PF1 1050W/1200W

Samsung Gaming Hub Now Available on 2022 Smart TVs and Smart Monitor Series
Consumer Electronics

Samsung Gaming Hub Now Available on 2022 Smart TVs and Smart Monitor Series

Popular Reviews

CeBIT 2005

CeBIT 2005

CeBIT 2006

CeBIT 2006

Zidoo Z9S 4K Media Player review

Zidoo Z9S 4K Media Player review

LiteOn iHBS112 review

LiteOn iHBS112 review

Club3D HD3850

Club3D HD3850

External USB Slim Recorders Comparison

External USB Slim Recorders Comparison

Pioneer BDR-2207 (BDR-207M) BDXL burner review

Pioneer BDR-2207 (BDR-207M) BDXL burner review

Crucial P1 NVMe 1TB SSD review

Crucial P1 NVMe 1TB SSD review

  • Home
  • News
  • Reviews
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed